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AGENT-3D can look back on a successful year 2016 and already an even more successful and eventful first half year 2017. Technology projects started and new projects were developed. The association AGENT-3D also represented itself at trade fairs to promote the joint Project.

Rapid.Tech 2017

Running technology projects
In autumn 2016, two new technology projects started. AGENT_FunGeoS took its first steps in September 2016 followed by AGENT_elF in October. In 2017 three other projects began: AGENT_multiBeAM in February, AGENT_IMPRoVE and AGENT_CastAutoGen in May.

For further Information please see here.


Election of board and chair of the association
The semi-annual meeting of the AGENT-3D association took place once again in Dresden in March 2017. One of the outcomes of the meeting was the re-election of the board and chair. The great support confirms the good work of the board. The reelected chairman, Prof. Leyens, is supported by the two deputies, Dr. Janny Lindemann from GfE-FREMAT, Freiberg, and Mr. Martin Schäfer from Siemens AG, Berlin, further on. We are thankful for the past coorporation up to now and offering our congratulations to the old and new board!    


New technology projects
In April 2017, the advisory board put the project proposals to the acid test after the third call for projects. The advisory board members chose 5 project ideas. Now it is the turn of the project partners 3D-Osseo-Distrakt, AutoPust, HERTZ, MikroDent and Toolprint to develop full proposals. The project plans were submitted this summer. We are looking forward to the new technology Projects!


AGENT-3D presents itself - Trade fairs
From April 24th to April 28th the annual trade fair HANNOVER MESSE took place. It is the most important global industrial fair with over 6.500 international exhibitors. The AGENT-3D association also took part together with Dresden University of Technology.

Later this year in June AGENT-3D introduced itself for the first time with its own fair stand on the Rapid.Tech in Erfurt, Germany. New contacts were forged and the association has enhanced its visibility to the additive manufacturing sector.

Next month our semi-annual meeting will be held within the framework of the WerkstoffWoche in the Dresden fair. We cordially invite everyone interested in the topic of additive manufacturing to visit both the meeting and the fair.

For your free ticket, you need to book in advance on:
https://www.werkstoffwoche.de/info/anmeldung/registrierung-fachmesse/

Go back

© photo: Fraunhofer IWS

Until now it was not possible to completely melt pure copper with a 3D printer ...

© Pexels

The association meeting planned for May 05, 2020 has to be postponed.

© Foto: EFDS

After a successful kick-off event in 2019, the 2nd SurfAM workshop will take place from 26th to 27th May 2020 in Dresden on numerous important topics of postprocessing and surface modification of additively manufactured components.

Rapid.Tech 2017

AGENT-3D can look back on a successful year 2016 and already an even more successful and eventful first half year 2017. Technology projects started and new projects were developed. The association AGENT-3D also represented itself at trade fairs to promote the joint project.

information platform: 3D printing and the law

Exactly on schedule, the “Information platform: 3D printing and the law” (of our partner TU Berlin) went online on May 31, 2016.

© Fraunhofer IWS Dresden

Dresden presents itself as a center for 3D printing at the world’s leading trade fair for industrial technology: HANNOVER MESSE 2016. AGENT-3D is also represented.

© Fraunhofer IWS Dresden

The kick-off meeting of AGENT-3D_Basis_Rahmenbedingungen took place in Dresden on January 11, 2016.

AGENT3D creative workshop
© Fraunhofer IWS Dresden

In a further step, new project ideas were developed together with the carbon-concrete experts of C³ in a brainstorming session stimulated by various keynote speeches.

AGENT3D creative workshop
© Fraunhofer IWS Dresden

Founded at the creative workshop on September 1, 2016, the taskforce “Polymers” came together at Fraunhofer IWS for an active exchange of ideas.

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